Mesoscale simulation of the mold filling process of Sheet Molding Compound
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Sofort verfügbar, Lieferzeit: 1-3 Tage
Produktnummer:
9783731511731
Sheet Molding Compounds (SMC) are discontinuous fiber reinforced composites that are widely applied due to their ability to realize composite parts with long fibers at low cost. A novel Direct Bundle Simulation (DBS) method is proposed in this work to enable a direct simulation at component scale utilizing the observation that fiber bundles often remain in a bundled configuration during SMC compression molding.
| Autor: | Meyer, Nils |
|---|---|
| EAN: | 9783731511731 |
| Sprache: | Englisch |
| Seitenzahl: | 294 |
| Produktart: | kartoniert, broschiert |
| Verlag: | KIT Scientific Publishing |
| Schlagworte: | Prozesssimulation Maschinenbau |
| Größe: | 210 × 148 × 17 |
| Gewicht: | 550 g |
