Advanced Wirebond Interconnection Technology
Advanced Wire Bond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not the least, operator training. This book is intended to be a comprehensive source of information and knowledge that enables both a newcomer to the field and a veteran who needs instant information to make a decision on a process problem. The book explains not only how to do things such as: designing a bond pad or a lead finger, how to select a right bond wire, how to design a capillary and how to optimize a bonding process on the factory floor; but the book also explains why to do it that way.
| Autor: | Prasad, Shankara K. |
|---|---|
| EAN: | 9781402077623 |
| Sprache: | Englisch |
| Seitenzahl: | 669 |
| Produktart: | Kassette / Medienmix z.B. Audio und Buch |
| Verlag: | Springer Springer Netherlands Springer US |
| Schlagworte: | Elektrische Leitung / Elektrizitätsleitung Verbindungstechnik |
| Größe: | 235 |
| Gewicht: | 1120 g |
